Ansijstd006 requirements for electronic grade solder. The ipcjstd002e standard also includes a test method for the resistance to dissolutiondewetting of metallization. Free download i ipcjedecjstd609a marking and labeling of components, pcbs and pcbas to identify lead pb, leadfree pbfree and other attributes provides a marking and labeling. Ipc jstd006c requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications developed by the solder alloy task group 524c of the. Hot solder dip meets the tinning requirements of ansiipc jstd001e, class 3, and. Since its first edition in 1994, the 607 standard has grown increasingly comprehensive and useful for grounding and bonding. Ipc jstd 006, requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications. Jstd006 requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications published by ipc on july 1, 20 this standard prescribes the.
Flux classification part 1 interpretation of jstd001 and jstd004 regarding fluxes. Joint industry standard requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications 4th interim final ansi jstd 006. The jstd006cam1 amendment provides better detail of a solder alloys maximum allowed deviation about the nominal level of the elements mass than was provided in past alloy. Ansijstd005 requirements for soldering pastes ansijstd006 requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications. Ansijstd004 requirements for soldering fluxes ansijstd005 requirements for soldering pastes ansijstd006 requirements for electronic grade solder alloys and fluxed and. It is available as solid wire or flux cored wire in a wide variety of diameters and. Solder alloys used for solder dip are in accordance with jstd006. Jstd006b standard jstd006b pdf standard 2112018 standard for commercial building energy audits ansi approvedacca cosponsored. Kester solder wire meets ipc specifications jstd006c amendment 1. Order reprints ipca610 and ipcjstd001 are widely believed to ensure high reliability of electronic assemblies. Joint industry standard solderability tests for printed boards 1st working draft ansi jstd 003 april 1992 in d u s t r e s est. Jstd006c requirements for electronic grade solder alloys. Solder wire 6337 tinlead, ipc,ansijstd 006 and astm b32 standards. Ipc jstd006c requirements for electronic grade solder.
Download ansi, american national standards institute. Ipceca jstd002 complete document revision d, march 14. Jstd006b standard jstd006b pdf standard 2112018 standard for commercial building energy audits ansi approvedacca cosponsored standard 90. Ipc jstd006 requirements for electronic grade solder. Kester bar solder, ultra low dross, sn63 pb37, 123 lb. Once you have joined our webinar, you will see this. Requirements for electronic grade solder alloys and. This part is designed to terminate a single 26, 28 or 30 awg wire. Ipc jstd006, requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications.
Requirements for electronic grade solder alloys and fluxed. January 1, 1995 requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications this standard prescribes the requirements and test. Joint industry standard requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications 4th interim final ansi jstd 006 january 1995 i n d u s t r e s est. It is also designed for use on microminiature connectors having a, amend angles. Peter, take a look at ipcansi jstd001a and b, jstd004 and i think, 005006 which cover solder paste. This document provides guidance for manufacturers and. Ansijstd004 requirements for soldering fluxes ansijstd006 requirements for electronic grade solder alloys and fluxed and non. Ipc j std 006c requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications developed by the solder alloy task group 524c of the assembly and joining committee 520 of ipc users of this standard are encouraged to participate in the development of future revisions.
Jstd001f requirements for soldered electrical and electronic assemblies redline comparison of revision e to f this comparison is primarily to show technical changes, deletions and additions. Ncsmq90 solder paste 97640 a4 r8 indium corporation. Free ipc standards and amendments for download for printed circuit board. Fluxcored solder shall be either composition sn60 or sn63. A newly released version of a standard that has come a long way. For standards issued by another organization, even if approved by. Download ansi, american national standards institute, standards ansi is a private, notforprofit, membership organization that acts not as a standards developer, but as a standards coordinating and.
This standard outlines a process to classify and label a nonsemiconductor components process sensitivity level psl and moisture sensitivity level msl consistent with the semiconductor. Ipc jstd006c prescribes the nomenclature, requirements and test methods for electronic grade. Ipc j std 006c requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications. Ipceiajstd006 archives document centers standards forum. Ansiipc jstd004b requirements for soldering fluxesipc jstd006b requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders. Shop for 0463370030 kester bar solder, ultra low dross, sn63 pb37, 123 lb. Ipc jstd006c requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications ipc on. Ipc jstd002e solderability tests for component leads, terminations, lugs, terminals and wires. This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys. Jstd006b wamendment 1 october 2008 jstd006b january 2006 amendment 1 june 2008 jstd006a may 2001 jstd006 january 1995 amendment 1 july 1996. List of available ansi american national standards institute standards. Ansiipc jstd004b requirements for soldering fluxesansiipc jstd005 requirements for soldering pastes, includes amendment 1 2007ansiipc jstd004a. Kays puretronix wire solder is extruded and manufactured using state of the art extruding and wire drawing processes.
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